South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

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The US chip designer plans to fulfil initial orders from existing stock, with shipments expected to total 5,000 to 10,000 chip modules – equivalent to about 40,000 to 80,000 H200 AI chips, the ⁠first ...

The facility will be built in modules, potentially reaching a total output of 880,000 tons per annum, with initial exports slated for 2029, targeting European and Asian markets. Once fully operational ...