Abstract: In a chiplet design, several dies are integrated through die-to-die interconnects. Technical challenges still exist when it comes to the repair of faulty die-to-die interconnects to boost ...
Abstract: Seismic fault interpretation is a critical task for subsurface modeling and resource exploration. Although data-driven deep learning methods have shown considerable potential in automating ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results