Southern Arkansas University Tech said it has secured $20 million in federal funding to establish a Defense Manufacturing ...

Hanno Kirner, CEO of Dyson highlights Singapore as prime location for advanced manufacturing. He points to the country’s highly skilled engineers, stable business environment and strategic position at ...

HAMILTON, Ohio — Hamilton’s new Advanced Manufacturing Workforce and Innovation Hub is central to the region’s advanced manufacturing education, training and industry partnerships and poised to have a ...

CMP Advanced Mechanical Solutions, a Canadian-based battery company, will be modernizing its Binghamton battery facility with an $8.8 million project. The project is supported by a $850,000 Empire ...

Miami University and Butler Tech opened a new Advanced Manufacturing Workforce and Innovation Hub in Hamilton Feb. 2, a $31 million project. Corrie Schaffeld | CBC To ...

As AI continues to evolve, its capacity to innovate and optimize will further solidify its role as a cornerstone of modern ...

Manufacturing companies face mounting pressure to improve operational efficiencies, reduce costs, and create better work environments. They are also tasked to meet increasingly stringent environmental ...

Combine scalable analytics with advanced AI capabilities like LLMs and agentic tasks to create a new chipmaking platform.

TSMC plans to mass-produce advanced 3-nanometer chips at its facilities in Kumamoto, southern Japan, with total investment expected to reach about $17 billion, reported Japanese newspaper Yomiuri on ...

Hamilton’s new Advanced Manufacturing Workforce and Innovation Hub is central to the region’s advanced manufacturing education, training and industry partnerships and poised to have a big economic ...

Enterprises that seek to become proficient in advanced manufacturing must incorporate manufacturing management tools and integrate data throughout the supply chain. This course makes participants ...

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.