Experience real-time co-simulation of circuits and PIC firmware in a single unified workspace—KTechLab’s capability that lets ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

Semiconductor and technology firms are rushing to develop chips that can cater to specific applications, such as for artificial intelligence (AI) workloads inside mammoth data centers and for base ...

Researchers from McMaster University and the University of Pittsburgh have created the first functionally complete logic gate ...

Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) based on wafer-scale two-dimensional (2D) semiconductor materials.

Lightwave Logic Announces Launch of Technical Program With Second Fortune Global 500 Customer; Novel Material, CPO Assembly Process and PDK to Be Co-Developed for 400Gb/s AI Networking Applications ...

Addressing the accuracy concerns for the PWM programming of standard regulators requiring an output that can swing below the ...

BAE Systems has added new capabilities to its next-generation, radiation-hardened 12 nanometre (nm) Storefront ...

The bidirectional flyback-based active cell balancing approach offers a compact and scalable solution for modern multicell ...

Heavy machinery is entering a new phase where hydraulics, electronics and embedded software are engineered as one integrated ...

MANASSAS, Va., Nov. 19, 2025 /PRNewswire/ -- BAE Systems (LON: BA) has added new capabilities to its next-generation, radiation-hardened 12 nanometer (nm) Storefront. The RH12™ Storefront is an ...