From 10 to 12 March 2026, the embedded world Exhibition&Conference will once again transform Nuremberg into the meeting place ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Taiwan's IC design landscape is undergoing a massive structural shift. Early 2026 revenue data reveals a dual-track ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded memory. While most chip designers feel the impact indirectly, vendors ...

Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa One smart verification software portfolio to accelerate creation, verification planning, ...

A number of Chinese universities and research institutions have achieved major progress in semiconductor-related fields. These advances span key areas such as memory, power semiconductor and IC design ...

ISSCC addressed challenges for electronics to meet AI demand, AI to speed up the design and training the next generation ...

One cannot imagine the world now and in the future without integrated circuits (IC or generally known as chips). With worldwide revenue projected to be about $500 billion by the end of 2019, the chip ...

Learn about agentic design automation, which Mark Ren, CEO of Agentrys and DesignCon keynote speaker, says will lead us into ...

To fill the talent gap, CS majors could be taught to design hardware, and the EE curriculum could be adapted or even shortened.

Foodie Bethany Gaskin shows how to prep Smackalicious Sauce a day ahead, turning a kitchen tutorial into a flavor-packed adventure. Seahawks coach Mike Macdonald in total disbelief after winning the ...