The new LED driver also features analog and PWM dimming of the LED current via a DIM pin and has a 1% reference tolerance.
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state resistance.
An RF+SiP device dramatically reduces SWaP while featuring an open-standard digital interface for tuning, monitoring, and control.
Resistance soldering offers precision heating placement, heat control, minimal risk to adjacent components, and convenient operation.
The new LED driver also features analog and PWM dimming of the LED current via a DIM pin and has a 1% reference Continue Reading ...
Resistance soldering offers precision heating placement, heat control, minimal risk to adjacent components, and convenient Continue Reading ...
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state Continue Reading ...
A new SiC manufacturing process for power MOSFETs enables increased die per wafer and improved on-state Continue Reading ...