Intel is looking to the future, aiming to make PCs more modular and easier to repair in a move to reduce e-waste. According to the company’s Community post, it is proposing to separate the all-in-one motherboard designs used in laptops into three pieces.

Intel’s proposed design integrates separate components for the new LPCAMM memory standard, plus the more common Wi-Fi and SSD upgrades that can be handled with M.2 cards. Intel says that these designs offer “seamless scaling” for laptops with screen sizes from 14 to 16 inches, with options for fanless, single-fan, and dual-fan cooling.

Whatever your stance on environmental conservation as a whole, you have to agree that generating millions of tons of e-waste due to obsolescent hardware is sub-optimal. There are a lot of reasons to want to reduce this number,