Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...

Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...

SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix Designed to enhance the safety of operators and equipment; complies with regulations SANTA ROSA, ...

FREMONT, CA / ACCESS Newswire / August 26, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received a purchase order from a ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...