Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

With the industry recovery coming on slowly, cost is a more important factor than ever. Semiconductor manufacturers are constantly under pressure to reduce costs, and during a down cycle they must do ...

San Francisco —Competing industry teams are racing to develop wafer-level packaging (WLP) as front- and backend semiconductor manufacturing and assembly technologies converge in the advanced packaging ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

CONCORD, Calif.--(BUSINESS WIRE)--Nordson MARCH, a division of Nordson (NASDAQ:NDSN), a global leader in plasma processing technology, will present the paper, "Plasma Applications for Wafer Level ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Dr. Navid Asadi’s group takes a look at wafer to panel level chip packaging. This is the six of a mutlipart series on chip packaging technologies. Navid Asadi is an assistant professor in the ...

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

Aims to improve the long-term reliability of hermetically sealed sensor packages. WESTFORD, Mass.--(BUSINESS WIRE)--Materion Corporation (MTRN) announced today that its Precision Optics business has ...