The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...

ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal. While sawing ...

The wafer dicing process, a critical stage in semiconductor production, involves the precise cutting of silicon wafers into individual die components, which are essential in a wide range of electronic ...

The rise in consumer electronics demand and the trend toward smaller electronic devices and the surge in demand for thinner wafers and more robust chips across the world drive the growth of the global ...