[Semiconductors] Why 'grind and flatten' wafers? — The reason why the CMP process became necessary

What you will learn in this article Why surface irregularities accumulate each time a film is deposited, causing focus issues ...
Yahoo Finance

Axus Technology Delivers Industry’s Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers

Capstone CS200 CMP systems from Axus Technology enable customers to realize per-wafer CoO savings of more than 50% for CMP processes on 200mm SiC wafers, compared to the closest competitor. · ...
Yahoo Finance

Chemical Mechanical Planarization Slurry Market Size Worth $2.7 Billion by 2030 - Manufacturers' Growing Investments in Semiconductor Wafer Fabrication Materials

Newark, Dec. 08, 2022 (GLOBE NEWSWIRE) -- As per the report published by The Brainy Insights, the global Chemical Mechanical Planarization (CMP) slurry market is expected to grow from USD 1.5 billion ...
EDN

Lam says new platen controls CMP processes within 2 mm of wafer’s edge

FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
The Desert Sun

SiC Wafer Processing Market Expansion Accelerates, Projected to Reach US$ 2,986.44 Million by 2032

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...
AZOM

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

Global Market Forecast Report for CMP Polishing Slurry: Growth Rates, Major Company Surveys, and Rankings 2026-2032

SummaryThe CMP polishing slurry market is a sector expected to see sustained growth against the backdrop of semiconductor ...
Machine Design

Next-generation plastics let wafers fly through manufacturing

As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...
Business Insider

REVASUM (ASX:RVS) announces the release of a 200mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...
EDN

France’s CMP offers access to ST’s 65-nm process

LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...