Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of the DesignWare ...
DesignWare CXL IP supports AMBA CXS protocol to enable seamless integration with scalable Arm Neoverse Coherent Mesh Network The Synopsys CXL IP, operating at 32GT/s with 512-bit data width, supports ...
Achronix selects Synopsys' DesignWare PCI Express 5.0 and DDR4 IP due to their robustness, maturity, and superior features Silicon-proven PCI Express 5.0 IP, with configurable 512-bit architecture and ...
MOUNTAIN VIEW, Calif., May 27 /PRNewswire-FirstCall/ — Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and ...
Synopsys is First to Deliver PCI Express Gen II Digital IP for Increased Bandwidth in Networking, Embedded and Computer Applications MOUNTAIN VIEW, Calif. – January 24, 2006- Synopsys, Inc.
September 11, 2013. Synopsys Inc. has announced the availability of its DesignWare STAR Hierarchical System, an automated hierarchical test solution for efficiently testing SoCs, including ...
MOUNTAIN VIEW, Calif., June 6 /PRNewswire-FirstCall/-- Synopsys, Inc., a world leader in semiconductor design software, today announced the addition of Serial ATA ...
SAN JOSE, Calif.--(BUSINESS WIRE)--MulticoreWare joins the Synopsys DesignWare® ARC® Access Program as one of their trusted partners, offering model optimization techniques enabling DesignWare ARC ...
Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded memories, ...
Fort Worth, TX. Synopsys is presenting news on a variety of fronts at the International Test Conference here this week. The company said that Imagination Technologies is leveraging Synopsys’ ...
Synopsys has launched what it said is the industry’s first complete HBM3 IP solution, including controller, PHY, and verification IP for 2.5D multi-die package systems. HBM3 technology helps designers ...