Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
After only six months of preparation, Japan’s NH Techno Glass (NHT) celebrated the opening of a TFT LCD glass substrate back-end processing line in the Tainan Technology Industrial Park (TTIP) on May ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
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