How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations. Ansys RedHawk-CPA is an integrated chip–package ...
As Set-Top-Box(STB) SoC designs become extremely complex with multi-million gates, lowering of voltage supplies, and multiple clock domains including high and low frequencies, evaluating the ...
Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...
Set-Top-Box(STB) SoC designs are extremely complex with multi-million standard cells, higher core utilization of around 70-80 %, and multiple clock domains including high and low frequencies. An ...
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