IXYS Corporation announced its new 60 V, dual and normally open solid-state relay with the highest current rating in a SOIC package. It provides 400 V of input-to-output isolation; and comprises two ...
Next-generation automotive and power applications will benefit from a fully qualified family of high-reliability small-outline IC (SOIC) packages. The narrow-body packages provide zero delamination ...
San Jose, Calif. — Avago Technologies has expanded its family of 3.3 V, 15 MBd, multi-channel and bi-directional digital optocouplers in compact (9.9 x 5.9 x 1.7 mm), 16-pin thin SOIC packages. The ...
The Endura ISL6529 dual regulator IC targets the video and graphics market. Housed in a 14-lead SOIC package, it can power both a graphics processing unit (GPU) and ...
Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...
The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest ...
[Czar] was working on a project with the Raspberry Pi using the MCP3008 analog to digital converter. The surface mount SOIC version of this chip was slightly cheaper, and there’s always a way to make ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results