By Milana Vinn and Amy-Jo Crowley NEW YORK/ LONDON, March 12 (Reuters) - BE Semiconductor Industries has been fielding takeover interest, as demand for its chip-packaging technology has become more ...

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

At the leading global packaging exhibition Interpack, the company will highlight its efficient, scalable, and sustainable packaging systems designed for a broad array of industries.

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

SK hynix has just announced it signed a memorandum of understanding with TSMC for collaboration to make next-generation HBM memory and enhance logic and HBM integration through advanced packaging ...

CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...

RIT’s print and graphic media technology curriculum is being integrated into the packaging science program to align with growing and evolving industries. “For generations, the print and graphic media ...

South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that promises to advance ...

Future-ready pharma packaging must integrate connectivity, automation, and material strategy into a single, coordinated approach rather than treating them as separate initiatives.

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

By Milana Vinn and Amy-Jo Crowley NEW YORK/LONDON, March 13 (Reuters) - BE Semiconductor Industries has been fielding takeover interest, as demand for its chip-packaging technology has become more ...