It puts packaging on display with their products, in such a way that high-end brands have invested a lot in high-end ...

Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as ...

LG Chem, Asahi Kasei, and Sumitomo Chemical—have collectively announced plans for capacity expansion, technical cooperation, ...

Rice husk, the hard-protective layer that envelopes the inner grain of rice, constitutes approximately 20%–25% of the entire rice structure and produces a considerable amount of by-products. In a ...

Mono-material flexible film packaging structures based primarily on polyethylene (PE), polypropylene (PP), or even polyethylene terephthalate (PET) are being promoted as an effective means of ...

Applied Materials targets over 50% packaging revenue growth in 2026 as AI demand fuels HBM, 3D chiplet stacking and ...

Sustainable packaging is becoming a central focus for tech companies aiming to reduce environmental impact while maintaining product protection. Innovations like fiber-based materials, compostable ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...