When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on ...

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on ...