The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

FedEx Corp. said its TechConnect division has opened a 30,000-square-foot package laboratory to provide testing and design services. The laboratory can simulate any part of the FedEx network, from ...

ASE Technology Holding Co., Ltd. ASX is benefiting from a favorable semiconductor industry backdrop, driven by surging artificial intelligence (AI) adoption, growing high-performance computing (HPC) ...

The emphasis on heterogeneity is increasing the burden on OSATs and foundries to make sure everything works as expected inside a package. Putting a variety of chips or hardened IP blocks into a ...

Packaging is available in a whole range of shapes and sizes and is comprised of various materials depending on what kind of product the packaging is designed to protect. Common packaging types include ...