As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...
The shift from planar devices to finFETs enables chipmakers to scale their processes and devices from 16nm/14nm and beyond, but the industry faces several challenges at each node. Cost and technical ...
Continued demand for mature- and mid-node production: Many analog, power, sensor and packaging layers continue to be manufactured using DUV (28–65 nm and larger), maintaining persistent equipment ...
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