Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...
SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...
Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd.TEL announced that its LGA (land grid array) 3647 Socket would be used in Intel Corporation's INTC new processors per ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
As some of the newer dc-dc point-of-load (POL) converters are packaged into smaller and smaller surface-mount packages, thermal and electrical layout Dara Crowe, Product Manager, Power-One, Camarillo, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results