New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology, CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum Written by Silicon Box ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is ...

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while ...

MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...

Global semiconductor equipment company Lam Research announced on the 14th that it will introduce deposition equipment for advanced packaging and strengthen collaboration with the domestic ...