The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...

LONDON--(BUSINESS WIRE)--Technavio has been monitoring the molded interconnect device (MID) market and it is poised to grow by USD 862.93 million during 2020-2024, progressing at a CAGR of over 12% ...

Because many of today's information technology (IT) systems are designed with a distributed architecture, featuring networked servers, peripherals, and interconnection devices located in a common area ...

LONDON--(BUSINESS WIRE)--Technavio has been monitoring the molded interconnect device (MID) market and it is poised to grow by USD 862.93 mn during 2020-2024, progressing at a CAGR of over 12% during ...

As the speed of backplane interconnection systems increases, whether for networking, server or storage applications, connector manufacturers are finding it necessary to collaborate with silicon ...

Interconnects are becoming much more problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and ...