SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...

SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid ...

SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will ...

To help designers experiment with these architectures, NanoIC has released the first versions of its fine‑pitch RDL and D2W hybrid bonding PDKs. Built on the NanoIC pilot line, the kits provide access ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

Wei Shaojun, vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University, said at an industry event that AI accelerators consisting of 14nm logic chiplets and ...

Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented innovations covered by ...

With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...