A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Manufacturers of silicon carbide (SiC) and gallium nitride (GaN) power ICs leveraged the APEC 2024 conference to highlight their latest developments in wide-bandgap semiconductors. These devices offer ...
SemiQ Inc, a developer of SiC solutions, will debut its latest SiC module advances at the 2026 Applied Power Electronics Conference (APEC) from March 22nd to 26th, at the Henry Gonzalez Convention ...
Enhancing thermal management in electric vehicle propulsion systems: A focus on optimizing irregular pinfin structures and collaborative design with dc bus capacitors and motors The paper investigates ...
(MENAFN- GlobeNewsWire - Nasdaq) Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ ...
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