Mentor Graphics partnered with TSMC to add a spectrum of new capabilities for their mutual customers' adoption of 10nm FinFET technology. The new capabilities include advanced double patterning, DRC ...

The first 14nm test chips are beginning to roll out the door from foundries, and companies are beginning to trumpet their success. But before anyone pops the champagne corks, there are some caveats.

Dynamic power density and rising leakage power make it more important than ever to not only understand power, but their place in the entire design flow. With dynamic power density and rising leakage ...

The semiconductor industry faces a major change in the way that ICs are made in order to keep improving performance and density, a change that has potential ramifications for design methodologies.

The next frontier in the electronics industry is the FinFET, a new type of multi-gate 3D transistor that offers tremendous power and performance advantages compared to traditional, planar transistors.