SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...
Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2 ...
Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated ...
Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
Debian-based Linux distributions, such as Ubuntu, Linux Mint, and Debian itself, rely on robust package management systems to install, update, and remove software efficiently. One of the most critical ...
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