A key challenge facing the semiconductor industry is to combine Intellectual Property (IP) from various sources quickly and efficiently. Design times are continually pressurized by time to market ...
Memory systems have evolved a lot in the previous few years due to advancements in fabrication technology. High Bandwidth Memory (HBM) is an example of the latest kind of memory chips which can ...
eFPGA is available now on mainstream process nodes (40, 28 and 16), in sizes from 200 LUTs to 200K LUTs and with options for DSP and RAM integration to fit almost any customer need. Flex Logix has ...
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